Hexagon Metrology has improved the performance of its DEA GLOBAL Advantage 15.xx.14 and 20.xx.15 bridge CMMs.

The company says that it has achieved: "Remarkable improvements in terms of accuracy, thanks to an enhancement program strategy applied to several machine components, as well as to the manufacturing and assembly process". An accuracy of up to 3+3L/1000 µm (MPEE) has been achieved, in fact.

Improvements have been mainly obtained through: optimisation of the assembly process; finely tuned integration of Hexagon Metrology probing technology, machine and controller; enhanced geometrical compensation algorithms; standard structural multi-sensor temperature compensation; new Z ram made from silicon carbide, a latest generation material featuring fundamental capabilities in terms of rigidity and lightness, even superior to the currently used alumina ram. The silicon carbide ram is standard on DEA GLOBAL 20.xx.15 models.

A full range of Leitz scanning probes and probe heads offers the right solution to any scanning measurement requirement.

The recently introduced LSP-X1 scanning probe – ideal for touch-trigger measurements as well – complements and expands the existing LSP-X probe line. LSP-X1 can also be mounted on a motorized TESASTAR-m indexable measuring head.